2026 OCP Global Summit
Join Us at 2026 OCP APAC Summit - Discover UfiSpace's Next-Gen Liquid Cooling Solutions.
As AI computing and massive data transfer demands, network infrastructure faces unprecedented performance challenges. UfiSpace cordially invites you to join us at the OCP APAC Summit from August 11–12 to experience our latest 1.6T Liquid Cooled Solutions.
We are proud to showcase how we combine ultra-high bandwidth with innovative thermal technology to power the future of high-performance AI clusters.
Showcase Highlights:
▪ Advanced 1.6T Liquid Cooling Solution
▪ Open Networking Solution
2026 OCP APAC Summit Event Details
▪ Dates: August 11–12, 2026
▪ Venues: TaiNEX 2, Taipei
▪ UfiSpace Booth: PL08
To ensure you have dedicated time to connect with our technical experts at the OCP APAC Summit 2026, we invite you to schedule a personalized meeting by completing our online form or reaching out to your assigned salesperson.